Facilities

This lab equipped with several optical microscopes for basic sample observation and advance image recording.

Optical Microscopes

Magnification: X50 to X1000
Modes: Bright Field, Dark Field, Differential Interference contrast
Imaging: Digital camera
Analysis: Particle analysis, Image analysis, Quantitate metallography


Optical Microscope - image analyzer

Magnification: X50 to X1000
Modes: Bright Field, Dark Field, Differential Interference contrast
Imaging: Digital camera
Analysis: Particle analysis, Image analysis, stereological analysis


Mounting

Type: Hot Mounting
Temperature: 60-80C
Pressure:.....
Sample size: 30 mm standard
Mounting Material: Epoxy, Conducting Mount
Mounting Type: Transparent or Opaque


Mounting

Type: Cold Mounting
Temperature: Room temperature
Sample size: Any shape and size & Standard mounts
Mounting Material: Epoxy + Resin type
Mounting Type: Transparent or Opaque

Sectioning

Type: Low speed cutter
Cutting Wheel: Diamond coated copper wheel
Speed: Variable (up to 00 RPM)
Purpose: Sectioning small samples
Damage: Minimal


Sectioning

Type: High speed cutter
Cutting Wheel: Abrasive blades
Speed: 00 RPM
Purpose: Rough cutting & initial cutting
Damage: Few mm depth


Polishing

Type: Cloth polishing
Abrasives: Alumina suspensions, Diamond paste & Colloidal silica
Polishing: 10 um to 0.5 um (Al2O3) & 0.4 um (Colloidal Silica)
Cloth: Variable grades high quality cloths
Speed: Variable (up to 600 RPM)
Purpose: Final mirror polishing


Polishing

Type: Automated Cloth polishing
Abrasives: Alumina suspensions, Diamond paste & Colloidal silica
Polishing: 10 um to 0.5 um (Al2O3) & 0.4 um (Colloidal Silica)
Cloth: Variable grades high quality cloths
Speed: Variable (up to 600 RPM)
Purpose: Final mirror polishing

Polishing

Type: Electro-polishing, Electro etching
Polishing: Chemical polishing
Electrolyte: User defined electrolytes
Sample sizes: > 10mm
Control: Automated process for set voltage and temperature
Temperature: Controlled temperature
Purpose: Final mirror polishing, EBSD sample preparation


Heat Treatment

Type: High temperature furnace
Furnaces: 3 tubular furnaces
Temperature range: upto 1600°C
Attachments: Temperature controller, Atmospheric controller
Purpose: Heat treatment of metal

Heat Treatment

Type: Low temperature furnace
Furnaces: 2 muffle furnaces
Temperature range: upto 900°C
Attachments: Temperature controller, Atmospheric controller
Purpose: Heat treatment of metal


Hardness

Type: Vicker's micro-hardness
Indenter:
Load:
Measurement: Digital measurement and imaging coupled with software
Purpose: Surface hardness, measurement on small regions/specific region


Hardness

Type: Automated Rockwell hardness
Indenter:
Load:
Scale: HRA, HRB & HRC
Purpose: Bulk hardness


Grinding

Type: Abrasive belt grinding
Abrasives: Different grits of belt
Polishing: Coarse Grinding
Speed: Fixed
Purpose: Coarse grinding, Flat the surface


Grinding

Type: Abrasive belt grinding
Abrasives: Different grits of belt
Polishing: Coarse Grinding
Speed: Fixed
Purpose: Coarse grinding, Flat the surface


Hardness

Type: Vicker's micro-hardness
Turret: Automatic turret
Objective: 10X and 40X
Testing Force: 10g - 2Kg
Intender: Standard rectangular pyramid diamond intender
Measurement: Digital measurement and imaging coupled with software
Purpose: Surface hardness, measurement on small regions/specific region


Differential scanning calorimetry

Type: simultaneous analysis of TG with DTA mode and DSC mode
Sensor: pure platinum pan holder and reference ring
Temperature range: 15°C - 1000°C
Temperature Accuracy: <±0.5°C
Furnace Design: Vertical
Balance Design: Top loading, single beam
Balance Resolution: 0.1mg
Sample Pans: Alumina 180ml
Purpose: Thermal Analysis